As data centers adopt liquid cooling, fitting in new coolant distribution infrastructure can be a serious challenge. From hyperscale and colocation environments to edge applications, the Vertiv CoolChip CDU (the next generation of the Vertiv Liebert XDU family) simplifies your work with the flexibility to support rear door heat exchangers or direct to chip liquid cooling. The Vertiv CoolChip CDU’s compact footprint allows for in-rack, end of row, or perimeter placement options. When you incorporate the Vertiv CoolChip CDU, you can easily distribute coolant to efficiently manage power dense deployments with liquid-to-liquid heat exchange up to 100 kw, 450 kW, 600 kW, or 1,350 KW, and liquid-to-air heat exchange up to 70kW. The Vertiv CoolChip CDU provides a compact footprint for deployment flexibility, efficient coolant distribution to manage power dense applications, precise temperature control to eliminate thermal shock, redundant pumps and dual power feeds for reliable operation, and remote monitoring and communications for added peace of mind.
