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TeamConnect Ceiling 2
Sennheiser

TeamConnect Ceiling 2

The TeamConnect Ceiling 2 is a reliable ceiling microphone solution that is quick and easy to install. Thanks to the patented automatic dynamic beamforming technology, it adapts to the respective conditions on-site, without reconfiguration. Gain more flexibility and complete „freedom of speech“in your meeting- or lecture rooms for an individual meeting or learning environment and maximum productivity.

Specification
  • ARCHITECT‘S SPECIFICATION 

     The ceiling mounted microphone array shall be designed for fixed installation in medium to large conference rooms. The microphone array shall fit within the space of a standard 600 mm (2 ft.) ceiling panel and shall be mountable either onto or flush with the ceiling itself. Several mounting accessories shall be available, including a ceiling suspension kit, a ceiling fixation bracket as well as mounting brackets for US size ceiling panels and for 625 mm ceiling panels. Additionally, a VESA adapter shall be available for all standard 100 mm and 200 mm VESA mounting material. The microphone array shall consist of 28 Sennheiser KE 10-237 pre-polarized condenser microphone capsules and shall use beamforming technology that automatically focuses on whoever is speaking in the room. The beam will automatically detect the position of the person speaking and will follow the person around the room at all times. A threshold for the detection shall be adjustable. Live monitoring of the horizontal and vertical angle of the position shall be available in the Sennheiser Control Cockpit control software. The microphone array shall have a Dante™ interface with two RJ 45 sockets (Primary and Secondary) for digital audio output, supporting both redundant and daisy-chain modes. The microphone array shall also feature a 3-pin terminal for analog audio output, which is compatible with Phoenix contact MCVW 1.5-3-ST-3.81 connectors. In addition, the microphone array shall have an RJ 45 Ethernet socket for network control and easy configuration and monitoring using the Sennheiser Control Cockpit control software. The RJ 45 Ethernet socket shall also support Power over Ethernet, using the PoE IEEE 802.3af Class 3 standard. 802.1X network configuration shall be possible via SSH protocol. The microphone array shall feature a reset button for restoring the factory settings. The microphone sensitivity shall be 0 dBV/Pa (988 mV/Pa). The maximum sound pressure level shall be 104 dB SPL. The dynamic range shall be 93 dB(A). The microphone dimensions (L x W x H) shall be 590 x 590 x 43 mm (23.2" x 23.2" x 1.7"), weight shall be 5670 g (12.5 lbs). The operating temperature shall range from 0 °C to +40 °C (+32 °F to +104 °F). The storage temperature shall range from -10 °C to 60 °C (14 °F to 140 °F). The microphone array shall be tested according to UL 2043 rating. 

    The microphone array shall be the Sennheiser TeamConnect Ceiling 2.

     

    Product properties

    Dimensions (L x B x H): 590 x 590 x 43 mm 
    Weight: 5670 g (12.5 lbs)
    Audio Output: 1 x 3-pin terminal (fits Phoenix contact MCVW 1.5-3-ST-3.81) 2 x Digital Dante Network Audio (RJ-45 Primary and Secondary)
    Ethernet / Control: 1 x RJ-45 Ethernet Port for PoE power supply and data/control communication
    Supply voltage: 44 – 57 V DC PoE IEEE 802.3af Class 3
    Power consumption: max. 8.8 W
    Safety certification: UL 62368 certification (including UL 2043 testing and compliance)


    Acoustic properties

    Transducer principle: Pre-polarized condenser microphone
    AF frequency response: 160 Hz - 18,000 Hz
    Sensitivity: 0 dBV/Pa (988 mV/Pa)
    Signal-to-noise ratio: 83 dB (A)
    Latency: 4 ms
    Equivalent noise level: 11 dB (A)
    Number of KE 10-237 mikrofon capsules: 28
    Pick-up pattern: Beam Pattern
    Max. sound pressure level: 104 dB SPL
    Dynamic range: 93 dB (A)

     

    Ambient conditions

    Temperature:

    - Operation: 0 - 40°C (32 - 104 °F)

    - Storage: –10 - 60°C (14 - 140 °F)

    Realtive air humidity: 20 - 95 %, non-condensing

Technical specification
  • Unique ref.tcc2
  • Product familyBusiness Audio & Communication
  • Product groupUnified Communications and Meetings
  • TypeObject (single object)
  • Date of publishing2020-09-02
  • Edition number1
  • Height (mm)43
  • Width (mm)590
  • Depth (mm)590
Related
  • Material mainMetal
  • Designed inGermany
  • Manufactured inGermany
  • Weight Net (Kg)5.67
Classification
  • BIMobject CategoryElectronics - Audio Electronics
  • IFC classificationObject

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